BOND ACP and Debond Composite Panels, Page 14
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H profile for ACP bond is used to connect two boards in a row. The profile is designed for bond boards with a thickness of 3 mm. ATTENTION! By adding 1 item, you...
H profile for ACP bond is used to connect two boards in a row. The profile is designed for bond boards with a thickness of 4 mm. ATTENTION! By adding 1 item,...
L-profile for ACP bond is used to connect two boards in a corner. The profile is designed for bond boards with a thickness of 3 mm. ATTENTION! By adding 1 item you add 1m of...
L-profile for ACP bond is used to connect two boards in a corner. The profile is designed for bond boards with a thickness of 4 mm. ATTENTION! By adding 1 item you...
Cutting on a formatting saw. We format all types of board materials to the accuracy of 0.5 mm.
The Drain L profile for ACP bond is a framing profile with a corner overlap. The profile is designed for bond boards with a thickness of 4 mm. ATTENTION! By adding 1 item...
The framing U profile for ACP bond creates a design frame for the board and at the same time protects its core. The profile is designed for bond boards with a thickness of 3 mm....
The framing U profile for ACP bond creates a design frame for the board and at the same time protects its core. The profile is designed for bond boards with a...
ACP Bond sample (0,08/1mm, white RAL 9003/primer). Ideal for physical verification of color and material, giving you confidence before your final implementation. Sample size is...
ACP Bond sample (0,3/3mm, anthracite-gloss RAL 7016/antracite RAL 7016). Ideal for physical verification of color and material, giving you confidence before your final...
ACP Bond sample (0,3/3mm, black-gloss RAL 9005/black RAL 9005). Ideal for physical verification of color and material, giving you confidence before your final implementation....
