Debond and ACP Bond, Page 14
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H profile for ACP bond is used to connect two boards in a row. The profile is designed for bond boards with a thickness of 3 mm. ATTENTION! By adding 1 item, you...
H profile for ACP bond is used to connect two boards in a row. The profile is designed for bond boards with a thickness of 4 mm. ATTENTION! By adding 1 item,...
L-profile for ACP bond is used to connect two boards in a corner. The profile is designed for bond boards with a thickness of 3 mm. ATTENTION! By adding 1 item you add 1m of...
L-profile for ACP bond is used to connect two boards in a corner. The profile is designed for bond boards with a thickness of 4 mm. ATTENTION! By adding 1 item you...
Cutting on a formatting saw. We format all types of board materials to the accuracy of 0.5 mm.
The Drain L profile for ACP bond is a framing profile with a corner overlap. The profile is designed for bond boards with a thickness of 4 mm. ATTENTION! By adding 1 item...
The framing U profile for ACP bond creates a design frame for the board and at the same time protects its core. The profile is designed for bond boards with a thickness of 3 mm....
The framing U profile for ACP bond creates a design frame for the board and at the same time protects its core. The profile is designed for bond boards with a...
Steel sandwich panel with a thickness of 3 mm and dimensions of 1220 x 3050 mm, composed of two steel sheets with a thickness of 0.3 mm and an LDPE core (flammability E). The...
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